Ingot and wafer alignment Fast Crystal orientation for ingots and wagersMarking and measuring the in-plane direction.Materials: Si, Ge, InP, GaAs, SiC… Specification Parameter Value Miscut (error 𝝈) 0.1° or 0.01° Miscut range ±12° Throughput Miscut 20 sec Throughput In Plane Crystal Determination 20 sec Beam size 1mm x 1mm In-plane orientation precision 0.5° Higher precision specification are achievable upon request using a different optics. Analysis NIST SRM2012 Procedure Open diffractomer for Quality Control XRD or XRF Automation Software