Thin Film Analysis
X-ray thin film analysis is an established technique for the determination of the film thickness, structural parameters, composition and strain.
Film thickness can range from sub-nanometer to millimeter.
According to the film type, different X-ray techniques will be used in order to determine the parameters of interest.
- Layer thickness of thin films and multilayers.
- Layer and interface roughness.
- Surface density gradients and layer density.
- Interfacial structures.
- Layers/Films uniformity across the wafer.
- Minimum thickness ~ 1,5 nm
- Maximum thickness up to ~ 300 nm.
- Resolution ~ 1% of the measured thickness
- Lateral resolution (minimum spot size ~ 1 cm)
In-plane grazing incidence diffraction* is a technique used for fast determination of in-plane lattice parameters of ultra-thin epitaxial films, structural registry of the layer with respect to the substrate, lateral crystalline film quality.
*Als-Nielsen, J. & McMorrow, D. (2011). Elements of Modern X-ray Physics (2 ed.). Wiley. ISBN 978-0470973950.
X-ray diffraction under grazing incidence reduces the penetration depth of the incoming X-rays and thus allows measurements of nanometer thin films excluding part of the signal coming from the substrate.